言語
プロモーションパンフレット
ノッチ用面取砥石
産品詳細信息
Grinding wheel for bevel machining of semiconductor material substrates.
Notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing.
| Beveling silicon wafers | Beveling sapphire wafers | ||
| Notch machining | Wheel size | φ3.8×36L×11T×8U×1.4X | φ3.8×36L×11T×8U×1.4X |
Features
Even and ne diamond layer minimizes processing damage.
Wear resistant bond with a high grain holding force is used to achieve high shap eretention and a long life.
Highly precise slotted shape and nishing technology support various wafer shapes.
Copper-less supported.
